The Universal-S300 is a 12-inch CMP equipment developed by Hwatsing to meet industry-leading demands, integrating advanced polish-processes, high efficiency, and exceptional stability. This tool is equipped a stacked layout architecture to achieve high production capacity within limited machine space, equipped with an efficient transport and clean-system. Its modular design accommodates diverse customer requirements for different processes, meeting the growing need for enhanced cleanliness. The Universal-S300 enables superior global nanoscale planarization of wafers, fulfilling the requirements of advanced process technologies and enabling mass application in manufacturing processes such as integrated circuits and advanced packaging.
Universal-H300 is a 12-inch CMP equipment developed by Hwatsing to meet the leading-edge demands of the industry. It integrates advanced polishing technology, high efficiency and high stability. This equipment adopts an innovative polishing system architecture, which can significantly enhance polishing efficiency. It is equipped with more advanced cleaning technology to meet the increasingly demanding cleanliness requirements. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced process technologies. It has been widely applied in manufacturing processes such as integrated circuits, advanced packaging, and large silicon wafers.
Universal-300FS is a 12-inch CMP equipment innovatively developed by Hwatsing to meet the the leading-edge demands of the industry, integrating advanced cleaning processes, high efficiency and high stability. The equipment is equipped with diverse advanced cleaning technologies, superior polishing units, Integrates with multiple endpoint detection technologies, demonstrating superior comprehensive performance. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced logic process technologies, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips,etc.
The Universal-300 T is a leading 12-inch CMP equipment developed based on the advanced CMP equipment of Hwatsing and according to the industry's cutting-edge technology requirements. The equipment is based on the innovative technology of the independent intellectual property rights of Hwatsing, equipped with polishing units with superior performance, integrated with a variety of endpoint detection technologies, and equipped with more advanced combined cleaning technology, showing a better cleaning effect. This equipment can realize the global flattening of wafer at nanometer level, meet the requirements of advanced manufacturing technology, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips, etc.
The Universal-300 X is an advanced 12-inch CMP device developed for the current high-end market. The equipment uses Hwatsing's innovative technology with independent intellectual property rights, is equipped with superior performance polishing and cleaning units, and integrates a variety of advanced endpoint detection technologies. The equipment is efficient and stable, and the process combination is flexible, which can realize the global flattening of the wafer at the nanometer level, meet the needs of advanced manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
The Universal-300 Dual is a mature 12-inch CMP device developed based on the innovative technology of Hwatsing's independent intellectual property rights. The equipment is equipped with multiple sets of polishing units and cleaning units with superior performance, integrates a variety of advanced end-point detection technologies, and has excellent process adjustability and stability. It can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafers and other manufacturing processes.
The Universal-300 E is a mature 12-inch CMP device developed for the mid-to-high end market. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, integrated with a variety of advanced endpoint detection technology. The device has excellent process stability and high production efficiency, can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
The Universal-300 B is a 12-inch CMP device based on innovative technology developed by Hwatsing with independent intellectual property rights. The device is equipped with superior performance polishing units, compatible with 4/6/8/12 inch wafers, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has a small footprint, high cost performance advantages, can meet the needs of mature process technology, widely used in silicon wafer, third generation semiconductor, MEMS and other manufacturing processes.
The Universal-TGS200 is a chemical mechanical polishing system specifically engineered for third-generation semiconductor materials (SiC). It is equipped with three polishing modules based on a single-platen double-head design, and integrates post-cleaning modules, enabling double-sided wafer polishing. It features a high level of automation and high processing efficiency. It is suitable for the fabrication of silicon carbide (SiC) substrates, the verification of the performance of polishing consumables, the development of advanced CMP process, and other fields of third-generation semiconductor materials.
Universal-200 Smart is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, high output, stable performance, flexible process combination, can achieve ultra-high flatness of wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, silicon wafers, third-generation semiconductors, MEMS, Micro LED and other manufacturing processes.
Universal-200 is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing units with superior performance, compatible with 4/6/8/inch wafers, suitable for a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in silicon wafers, third-generation semiconductors, MEMS and other manufacturing processes.
Universal-200 D is a mature 8-inch CMP device developed on the basis of innovative technology with independent intellectual property rights of Hwatsing. The equipment is equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, applicable to a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in manufacturing processes such as silicon wafers, third-generation semiconductors, MEMS, Micro LED, etc.
The Universal-150 Smart is a mature 6-inch CMP device developed according to the current market requirements. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, compatible with 6/8 inch wafer, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has the advantages of flexible process matching and high yield, to meet the needs of mature process technology, widely used in the third generation semiconductor, MEMS and other manufacturing processes.
The Master-P510 polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of panels with dimensions not exceeding 510mm×515mm. Featuring a single polishing head and a single platen, it boasts low maintenance costs, flexible process switching, and no need for complex supporting facilities.
The Master-P510APEX polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of 510mm×515mm panels. Equipped with dual polishing heads and dual grinding plates, it integrates an online cleaning module, a fully automatic loading/unloading system and a flipping module to fulfill double-side polishing needs. Capable of continuous and stable operation, it meets the requirements of fully automated mass production.
iPUMA-LE is a 12-inch high-current ion implanter with horizontal ribbon beam developed by Hwatsing, which has evolved the beam from a mature vertical ribbon beam in accordance with the requirements of advanced industry technologies. The equipment uses advanced beam gradient technology. It intergrates magnetic field and electric field modules?,and it is equipped with precise measurement technology, demonstrating excellent ion selectivity capability and accuracy? to meet the demands of various process technologies. The equipment has been applied in semiconductor manufacture.
iPUMA-HT is a 12-inch hot ion implanter developed from a mature high current implanter by Hwatsing, under the requirements of advanced device technologies. The implanter is equipped with hot temperature module, temperature detection unit and cooling package to meet the demands of advanced process technologies. The equipment has been applied in semiconductor manufacture such as advanced logic device.
iPUMA-HP is a 12-inch hydrogen high-current ion implanter developed from a mature high current implanter by Hwatsing. The implanter is equippped with good particle selectivity and cooling module to meet the requirement of particle number and temperature control in the process flow of layer transfer technology.It could increase the productivity by hardware upgrade. The equipment has been applied in wafer maker manufacture.
iPUMA-LT is a 12-inch cold ion implanter developed from a mature high current implanter by Hwatsing, under the requirements of mature device technologies. The implanter is equipped with cryogenic operating module, temperature detection unit and temperature warm-up module to meet the demands of mature process technologies.
iPUMA-H is a 12-inch hydrogen high energy implanter developed based on the particle accelerator by Hwatsing. The equipment uses unique accelerator technology to enable hydrogen ions to acquire high energy. It is equippped with a thin wafer transfer system to meet the demands on power device.
The Versatile-GN200 is a high-rigidity and high-precision wafer grinder. Developed for the power semiconductor device . Adopting a novel layout, this equipment supports grinding on wafers of various material including Si, SiC, LiTaO?, and LiNbO?. Compatible with 4/6/8-inch wafers,Capable of integrated, it achieves fully automated processing including precise positioning, precision thinning, and double-sided cleaning/drying in a single workflow. Leveraging high-precision online measurement and exceptional surface profile control technology, the equipment achieves high-precision thinning, accommodating the ultra-precision wafer thinning requirements of the power semiconductor device.
A fully automatic edge-retaining wafer grinder compatible with 6/8-inch wafers, specifically developed for power semiconductor applications. Equipped with advanced edge-preservation gringding technology, it ensures superior mechanical strength after gringding, effectively preventing edge chipping and minimizing wafer warpage risks
Versatile-GP300 is an advanced 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing, advanced packaging and so on. The equipment integrates advanced ultra-precision grinding, CMP and post-cleaning technology through the innovative layout of the new complete machine, and is equipped with excellent thickness deviation and surface defect control technology. It can provide a variety of system function expansion options, with the advantages of high precision, high rigidity, and flexible process development. Versatile-GP300 can flexibly expand and develop a variety of configurations, which greatly meets the needs of ultra-precision wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.
Versatile-GM300 is an ultra-precision wafer grinding device innovatively developed for the packaging field. The equipment adopts a new layout, which can realize ultra-precision grinding and stress removal on the back of thin wafer; It is compatible with 8/12-inch wafers, and is equipped with a wafer laminating machine for online use, which can realize the whole process of automatic operation from precise thinning, cleaning and drying to sticking the material ring and back film stripping; The highly reliable wafer handling system effectively reduces the risk of thin wafer damage. Relying on the excellent online thickness measurement and surface defect control technology, the equipment has the advantages of high precision, high rigidity, flexible process development, etc., and meets the needs of thin wafer processing in the packaging field.
The Versatile-GM300CMP is a fully automaticwafer Grinder/Polisher and mounter independently developed by Hwatsing.This equipment is designed to meet the full-process requirements of wafer backside thinning, enabling integrated operations for wafer backside grinding, polishing, and tape-peeling, thereby significantly improving operational efficiency and process stability. It employs a combination of coarse grinding, fine grinding, and wet polishing to achieve superior wafer surface quality. The innovative four-plate three-axis platform ensures stable compatibility with both 8-inch and 12-inch wafers. Additionally, the integrated high-purity cleaning module significantly enhances wafer cleanliness in single-machine operation mode. The Versatile-GM300CMP supports a variety of materials, including Si, SiOx, EMC, LT, and LN, catering to diverse process development needs in advanced packaging, MEMS, and other fields.
Master-BN300 is a 12-inch wafer bevel precision polishing equipment developed based on cutting-edge industry requirements. This device integrates high-precision polishing, efficient cleaning, and precise measurement functions, adopts modular design, and is compatible with the needs of various processes and application fields. It can significantly improve the smoothness of wafer bevel, meet the technical requirements for high-precision bevel processing in the semiconductor manufacturing field, and has been applied in key processes such as storage chips and advanced packaging.
Master-BT300 is a 12 inch wafer edge precision polishing and trimming equipment developed based on advanced packaging requirements. It is used to solve problems such as wafer edge chipping, burrs, and to trim wafers. This equipment integrates high-precision polishing, trimming, efficient cleaning, and precise measurement functions. It adopts a modular design that can flexibly configure functions to meet the requirements of wafer edge polishing and trimming in advanced packaging fields such as HBM.
Versatile-DT300 is a high efficient and high clean fully automatic dual spindle wafer edge trimming equipment launched by Hwatsing. It is used to accurately solve the problem of edge chipping and breakage during wafer thinning and improve thinning quality. This equipment integrates multiple units such as cutting, transmission, cleaning, and measurement, and is equipped with multi-axis linkage high-precision cutting technology, fully automatic transmission, and high cleanliness cleaning technology. It is also equipped with high-resolution visual alignment and advanced measurement system. Versatile-DT300 has the advantages of high performance, compact size, flexible process, multi-mode combination, and multi-functional configuration, which greatly meets the technical needs of various wafer manufacturing processes and products such as Memory Chips, CMOS Image sensors, and Advanced packaging.
Versatile-DT200 is a high-efficiency, high-cleanliness fully automatic dual-wafer edge trimming equipment independently developed by Hwatsing. It is designed to precisely solve edge chipping during wafer thinning, thereby improving thinning quality.Versatile-DT200 combines cutting, transfer, cleaning, and measurement functions. It features multi-axis high-precision cutting technology, fully automatic transfer, high-cleanliness technology, and is equipped with high-resolution visual alignment and advanced measurement systems. Additionally, the equipment offers flexible size switching, diverse process options, and versatile functional configurations, making it highly suitable for advanced packaging, Micro LED, compound wafer, and other semiconductor manufacturing processes and products.
The HSC-D3810 is a next-generation single-wafer cleaning platform developed by Hwatsing for advanced process node. Featuring a dual-layer isolated architecture, advanced multi-chemical processing capability, and exceptional scalability of up to 20 chambers, it delivers throughput of up to 1,000 WPH, providing customers with a new standard in high-efficiency wafer cleaning solutions.
HSC-F3400 is a high-performance equipment developed by Hwatsing for the special needs of the large silicon wafer final clean market. It features excellent particle and metal contamination control systems, innovative cleaning and drying modules, and high-performance chuck holding technology.
HSC-F2400 is applied to final cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.
HSC-I2402 is applied to pre cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.
HSC-S1300 is a brush clean system mainly used in 4/6/8-inch compound semiconductors developed by Hwatsing for market demand,it features front and back scrubs and integrates superior cleaning and drying technology. In addition, it’s also compatible with acid solution cleaning/alkaline solution cleaning, transparent/opaque chip cleaning.
HSC-S3810 is a brush clean system developed according to the industry's cutting-edge technology, it’s based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior parameter closed-loop control system, it also has front, back and edge cleaning functions, and can achieve damage free cleaning. HSC-S3810 covers an area of small, high output.
HCC-3080S is a clean system for 4/6/8/12-inch wafer container, it adopts Hwatsing's innovative technology, equipped with superior performance water recovery device, its unique two-door design enables independent loading and removal of the cassettes before and after cleaning, with the advantages of high environmental protection and low consumption.
HBC-E3500 is a wet Bench clean system independently developed by Hwatsing based on market development frontier and customer demand，With strong compatibility, support a variety of process formula mixed operation. It adopts customized, modular design and flexible configuration to meet the process requirements of different customers.
HSDS series grinding fluid supply system adopts modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize parameters such as concentration, flow, pressure closed loop control, meet the semiconductor manufacturing process of wet process equipment such as grinding fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.
HCDS series chemical supply system, adopting modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize closed loop control parameters, meet the wet process equipment in the process of semiconductor manufacturing chemicals such as cleaning fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.
The Central Delivery System HSDS-AD2501 is a large-scale centralized supply system developed based on Huahai Qingke's Local equipment in accordance with the technological requirements at the forefront of the industry. This equipment is based on the innovative technologies with independent intellectual property rights of Huahai Qingke. It is equipped with an excellent hardware system, integrates a variety of online sample detection technologies, and is equipped with even better control technologies, demonstrating a powerful and stable supply capacity. This equipment can achieve the centralized supply of multiple liquids, meeting the demand for multiple streams of liquids in the utility system.
Film metrology equipment is based on the principle of eddy current non-contact measurement, it works efficiently, and can be measured without damage. It has high precision, reliable and accurate measurement results, and the measurement data can be processed automatically. The equipment is mainly used in Cu, Al, W, Co and other metal processes.
Hwatsing has a standard wafer reclaim production workshop, a professional CMP/Wet technology team, and comprehensive measurement and analysis instruments.Its measurement equipment already covers all mainstream metrology tools.The company provides full-range technical support, sales, and foundry services tailored to different process requirements, delivering high?quality services to over 30 domestic partners.The current Tianjin fab has a monthly capacity of 200,000 pieces of 12?inch reclaimed wafers. Upon completion of the second fab in Kunshan, an additional monthly capacity of 400,000 pieces will be added. Once operational, Hwatsing will become the leading reclaimed wafer manufacturer in China by output.
Key consumables and maintenance services mainly provide customers with maintenance and update services for key consumables of CMP equipment. Hwatsing has a team of process experts with years of experience in large-scale production lines, dedicated to providing customers with complete solutions. The company's independently controllable and highly stable supply chain system ensures the stable operation of the equipment.
Hwatsing Technology Co., Ltd. (Stock Code: 688120) is a high-end semiconductor equipment manufacturer with core independent intellectual property rights. The company’s main products include Chemical Mechanical Polisher, Grinder, Dicer, Wet Process Equipment, Implanter, Bevel Polisher, Wafer Reclaim, Consumables and Maintenance Service, and form the platform strategy of "equipment + service". The company's main products and services have been widely used in integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductor, MEMS，Micro LED and other manufacturing processes.
